Automatic Inspection Device for Wafer Chip Appearance
Achieving high-precision inspection with high-resolution, clear images.
Automatic inspection device for wafer chip appearance capable of expanding upper inspection.
- Company:英光産業
- Price:Other
1~3 item / All 3 items
Achieving high-precision inspection with high-resolution, clear images.
Automatic inspection device for wafer chip appearance capable of expanding upper inspection.
Automatic inspection of all inspection items for wire bonding.
This is an introduction to the automatic appearance inspection device for wire bonding used in power modules, handled by Eiko Sangyo Co., Ltd.
Automatically attach low-adhesion NG seals to defective areas.
Automatic visual inspection device for film printing that conducts comprehensive appearance inspections for printing omissions (defects), dirt adhesion, and printing position misalignment by comparing with standard images.